Breakthrough advantages in industrial and space product development
Miniaturized computing power for tough tasks and hostile conditions
ÅAC Microtec’s miniaturized electronics systems tolerate the explosive forces of being launched into space and the hostile conditions found there. Furthermore, we make them up to 200 times smaller and 70 times lighter than conventional solutions.
One of our devices – packed with high-performance, FPGA-based computing power – weighs just 3 grams. That includes a complete functional system containing logic, memory, power-handling and control interfaces for micromechanical sensors – an all-in-one solution known as a system-in-package (SiP).
Small, light and very robust
For demanding applications where space is at a premium, SiP solutions beat standard circuit-board approaches every time. Smaller, lighter, more robust and much easier to locate, they offer breakthrough advantages for developers of industrial products. Handling distributed intelligence in the joints of robotic arms and improving the performance of advanced construction equipment and power tools are tasks that our SiP solutions accomplish with ease. In addition, testing complex microchips by attaching interposers developed with XiVIA™ TSV technology will increase chip yield and cut the cost of production.
Fast and efficient. Easy to integrate
All our devices feature a high package density, which means fewer interconnect routing problems and reduced time delay for high-speed signals. They are also flexible and easy to integrate. nanoRTU, for example, functions either as an onboard computer with redundant interfaces or as a standard interface module with plug-and-play capabilities. Finally, their small size and weight makes it easy to build in redundancy for critical applications. Whatever your application, we offer fast time-to-market product development plus volume manufacturing.